2018 Micro LED Key Elements- Transfer Corresponds to Market Application Requirements

According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Micro LED Next-Gen Display Technology Market Report- 3Q18 Micro LED Transfer, Driver, Backplane and Application Requirements, the correspondences between each display specification and technologies such as mass transfer, driver and backplane have been discussed. Due to the differences of product properties and specifications for displays, mass transfer, drive and backplane need to correspond according to application characteristics of various display products. Therefore, for different areas of display products, manufacturers are in charge of the future direction of development.

Micro LED Mass Transfer Development Trend

Because currently there are a lot of mass transfer technologies and various properties, according to different display products, there will be relatively suitable solutions. Basically, at the present stage, there are stamp pick & place, laser release, roll to plate, fluidic transfer and wafer bonding. These transfer technologies correspond to various specification requirements of panel. For example, the size of panel is related to the technology of mass transfer for expansion. The height of PPI is related to the sophistication of mass transfer. In addition, resolution is related to the production efficiency of mass transfer. Chip size is related to the size limit of transfer technology for transfer target. Thus, in the future, according to different display products, there will be relatively suitable mass transfer technologies.

Micro LED Backplane Application Trend

The maximum of line width and line space from large to small is as follows: PCB > FPC > Glass > Si CMOS. Thus, owing to the difference of backplanes, the size of display changes. For example, in terms of large-size digital display and TV, because the display size is big, the pixel pitch is larger. There are PCB and glass for them to choose. For middle-size automotive display, glass and FPC are applied instead of PCB. For small-size cell phone and watch, glass and FPC, which are suitable for middle- and small-size display demand, are mainly applied. The backplane display demand of micro-display for AR/VR devices will be below 30 µm. Thus, Si CMOS will be mainly applied. Besides, with the demand of transparent eyeglasses, optical FPC will be needed.

Micro LED Drive Application Trend

By virtue of the continuous improvement of display technology, characteristics of Micro LED drive IC are also varied. Using Micro LED drive IC, the display’s grayscale can reach 16-bit in the case of high refresh rate. If the drive IC is fitted with Lighthouse controller featuring the technology of improving HDR brightness, then it can be obviously seen that the light and shade transition is more smooth, the light area is more bright, and shade area is more deep.

Light source of Micro LED display is in great number. If special drive IC that integrates multichannel design is used, then PCB line spacing and the number of drive IC can be effectively saved and reduced.

When Micro LED turns on, only 10nA is needed for driving power supply. But with such low current, the grayscale is not stable, which will cause failure in lighting up some part of the LEDs and faint light when Micro LED is receiving the same current, so it cannot achieve the design aim. This is the important problem that Micro LED drive IC must overcome.

 

2018 Micro LED Next-Generation Display Technology Market Report- 3Q18- Transfer, Drive, Backplane and Applications

Micro LED Key Technology Analysis

  • Micro LED Key Technology
  • Micro LED Transfer Patent Development Trend
  • Micro LED Backplane Application Trend
  • Micro LED Drive Application Trend

Micro LED Transfer Technology Analysis

  • Three Major Transfer Technologies Classification
  • Micro LED Thin Film Transfer Technology Classification
  • Pick and Place Transfer Technology Analysis
  • Electrostatic Adsorption vs. Magnetic Adsorption
  • Phase Change vs. Van der Waals Force
  • Adhesion and Reaction Force vs. Electrostatic Adsorption and Reaction Force
  • Chip Transfer and Flip vs. Solid Printing
  • Fluidic Assembly Transfer Technology Analysis
  • Fluidic Dispersion Printing vs. Fluidic Assembly
  • Laser Printing Technology Analysis
  • Laser Ablation vs. Laser Lift Off
  • Laser Beam Multi-Chip Transfer vs. Multi-Beam Transfer
  • Roller Printing Technology Analysis
  • Roll to Roll Transfer Rohinni vs. KIMM

 

  • Micro LED Product Application Specifications
  • Micro LED Transfer Technology Selective Comparison
  • Transfer Application Analysis- Digital Display
  • Transfer Application Analysis- TV
  • Transfer Application Analysis- Automotive Display
  • Transfer Application Analysis- Mobile
  • Transfer Application Analysis- Watch
  • Transfer Application Analysis- AR / VR

Micro LED Backplane Technology Analysis

  • Backplane Material Classification
  • Hard Backplane- Glass Material Operating Principle
  • Hard Backplane- Glass Material Property
  • Hard Backplane- Glass Material Property Comparison
  • Hard Backplane- PCB
  • Hard Backplane- Si CMOS
  • Flexible Backplane- Non-Optical FPC
  • Flexible Backplane- Optical FPC

Micro LED Key Technology

  • LED Drive Solution- Introduction of LED Driver
  • LED Drive Solution- Importance of LED Driver IC
  • LED Drive Solution- Relation between LED Voltage, Current and Luminous Flux
  • LED Drive Solution- Comparison between Linear Drive and Switch Drive
  • LED Drive Solution- Switch Control Technology Classification
  • LED Drive Solution- Influence of Switch Control PWM Technology on the Change of LED Color Scale
  • Display Drive Solution- Comparison between Active Matrix and Passive Matrix
  • Display Drive Solution- Scanning Mode and Frame Rate
  • Display Drive Solution- Fine Pitch Display Dead Pixels Analysis
  • TFT Drive Solution- TFT Drive Architecture
  • TFT Drive Solution- Analysis of Interference Factors Affecting Display Quality
  • OLED Drive Solution- Passive Matrix / PMOLED
  • OLED Drive Solution- Active Matrix / AMOLED
  • Micro LED Drive Solution- Passive Matrix
  • Micro LED Drive Solution- Active Matrix
  • Micro LED Drive Solution- Micro LED Driver IC

Appendix: Micro LED Manufacturer Trend

  • Mini/Micro LED Manufacturer Trend- Cell Phone, Automotive Display, TV and Gaming NB
  • Mini/Micro LED Manufacturer Trend- Display
  • Mini/Micro LED Manufacturer Layout Trend

 

Contact US: 

Taipei:

 

Joanne Wu        
joannewu@trendforce.com
+886-2-8978-6488 ext. 912

Grace Li
graceli@trendforce.com
+886-2-8978-6488 ext. 916

Disclaimers of Warranties
1. The website does not warrant the following:
1.1 The services from the website meets your requirement;
1.2 The accuracy, completeness, or timeliness of the service;
1.3 The accuracy, reliability of conclusions drawn from using the service;
1.4 The accuracy, completeness, or timeliness, or security of any information that you download from the website
2. The services provided by the website is intended for your reference only. The website shall be not be responsible for investment decisions, damages, or other losses resulting from use of the website or the information contained therein<
Proprietary Rights
You may not reproduce, modify, create derivative works from, display, perform, publish, distribute, disseminate, broadcast or circulate to any third party, any materials contained on the services without the express prior written consent of the website or its legal owner.

Some homeowners, commercial systems managers and outdoor lighting management companies have looked warily at smart lighting, in light of its being seen as a major departure from what was required for lighting control in the past. They need not... READ MORE

For the LED driver product line, wide AC voltage input range (180 ~ 528VAC) HVGC family, MEAN WELL now launches HVGC-650 series to offer more choices of high power products.

READ MORE