TrendForce’s latest investigations reveal that the anticipated launch of Apple’s first foldable device in the second half of 2026 is expected to lift foldable phone penetration from 1.6% in 2025 to over 3% in 2027. The evolution of foldable phones from multi-part hinge assemblies to integrated hinge designs, coupled with breakthroughs in materials, structures, and thickness, has enabled thinner and lighter devices. Among these advances, hinge technology has emerged as a key competitive focus.
Foldable hinge market to reach US$1.2 billion in 2025
TrendForce notes that since 2023, Samsung has adopted the Teardrop hinge in its Galaxy Z Fold 5 and Flip series, improving flatness, bolstering durability, and reducing crease visibility. This design has quickly become the industry standard, increasing the hinge’s share of overall device value while driving steady market growth. The global foldable hinge market is projected to reach US$1.2 billion in 2025, with hinges currently accounting for about 5–8% of the BOM cost per device.
To lower costs and improve yield rates, the industry is accelerating simplified hinge designs through modularization, mortise-and-tenon structures, and laser welding, while moving toward reference designs and common specifications. This trend is shifting hinge production from traditional material processing to system-level module supply, boosting assembly efficiency and optimizing supply chain profitability.
Several suppliers are increasing their investments. Taiwan’s Shin Zu Shin and U.S.-based Amphenol—longtime providers of high-precision hinges and metal components— are actively implementing standardized production processes in response to the mainstream adoption of Teardrop hinges.
Meanwhile, Chinese suppliers such as NBTM New Materials and Gian Technology are leveraging powder metallurgy and micro-mechanical precision processing to establish themselves in key components like foldable phone hinges and sliding rails, with clear cost and mass-production advantages in mid-range product lines.
Apple’s potential use of new materials could reshape the supply chain
The market is closely watching its choice of materials and suppliers as Apple’s entry into foldable devices draws closer. Apple is reportedly considering liquid metal as a structural material, aiming to combine light weight with high durability. Chinese firms such as Eontec already possess liquid metal forming capabilities. Should Apple also adopt 3D printing, composite materials, or specialized manufacturing processes, the move could trigger a full-scale upgrade of the high-end structural component supply chain.
Historically, Apple has not been a first mover in industry innovation but instead follows an “early majority adopter” strategy, entering markets once they mature and quickly differentiating to capture share while avoiding early-stage risks and high R&D costs. Apple’s entry signals the shift of foldable phones toward mainstream adoption, where core competition will center on manufacturing efficiency, cost control, and supply chain integration. In this new phase of simplified designs and cost pressure, suppliers that can simultaneously deliver technology, production capacity, and pricing flexibility will be the key beneficiaries of the next growth cycle.
