On August 27, San’an announced on its investor relations platform that the 8-inch silicon carbide (SiC) chip production line at its Hunan Sanan Semiconductor base has officially come online.
It took less than a year for Hunan San’an’s 8-inch SiC chip line to go from construction to operation, progressing faster than expected. As of August 2025, Hunan Sanan has established a relatively complete SiC industry chain capacity: 6-inch SiC capacity of 16,000 wafers/month, 8-inch substrate and epitaxy capacities of 1,000 wafers/month and 2,000 wafers/month, respectively. In addition, the company also has a GaN-on-Silicon capacity of 2,000 wafers/month.
The total investment in the Hunan Sanan SiC project amounts to RMB 16 billion, with the goal of building a vertically integrated mass production platform compatible with both 6-inch and 8-inch SiC. Upon reaching full production, it will be capable of producing 360,000 6-inch SiC wafers and 480,000 8-inch SiC wafers annually.
On February 27 this year, San’an and STMicroelectronics announced that their jointly established SiC wafer fab in Chongqing has also completed line commissioning. The project is expected to achieve mass production in Q4 this year, becoming the first large-scale 8-inch automotive-grade SiC power chip production line in China. Once fully ramped, the fab will be able to produce around 10,000 automotive-grade wafers per week.
(Photo credit: San’an)
