Coherent Corp., the global leader in photonics, today announced PhotonLink™, an integrated optics platform that brings together Coherent’s broad portfolio of critical photonics technologies, precision assembly and test capabilities to deliver complete optical solutions for next-generation AI datacenters. The platform supports co-packaged optics (CPO), near-packaged optics (NPO) and emerging chip to chip connectivity.

As AI systems continue to scale, demand for higher bandwidth and lower power is driving optical connectivity closer to compute and switching silicon. These architectures require lasers, silicon photonics, precision optics, fibers and detectors to work together. PhotonLink brings those technologies and the expertise to integrate them into one platform.

“The next leap in AI requires more than faster chips – it requires a new way to connect them,” said Jim Anderson, Chief Executive Officer at Coherent. “Customers need complete optical solutions, not just individual components. Coherent is uniquely positioned to bring together the critical technologies, integrate and test the finished assemblies, and manufacture them at scale. PhotonLink puts that capability to work for the next generation of AI infrastructure.”

Coherent’s vertical integration spans compound semiconductor materials, lasers, optics and specialty fiber through final assembly and test. PhotonLink gives customers access to both individual components and complete optical assemblies from one partner, helping simplify system design, streamline qualification and reduce the complexity of integrating technologies from multiple suppliers.

FROM CRITICAL TECHNOLOGIES TO COMPLETE OPTICAL ASSEMBLIES
The PhotonLink platform spans four functions of the optical path: Generate, Shape, Guide and Receive. The portfolio includes indium phosphide (InP) lasers, vertical-cavity surface-emitting laser (VCSEL) arrays, silicon photonics, isolators, specialty fibers, micro-optics and detectors. Coherent integrates these technologies into external laser sources, precision fiber assemblies and optical modules tailored to customer architectures.

CUSTOMER ENGAGEMENT AND MANUFACTURING SCALE
Coherent has more than ten CPO customer engagements and more than ten NPO engagements, with anchor customers and long-term agreements secured for both architectures. The company also has more than five engagements in emerging chip to chip connectivity. Revenue from the PhotonLink platform is expected to begin ramping in Q4 of CY2026.

PhotonLink builds on Coherent’s established datacenter manufacturing base, which has shipped more than 300 million InP lasers and more than one billion InP and gallium arsenide (GaAs) photodetectors. Coherent is expanding its 6” InP and specialty fiber manufacturing capacity to support the PhotonLink ramp.

PHOTONLINK AT ECOC 2026
Coherent hosted a PhotonLink launch event on September 21 at the Gran Hotel Miramar in Málaga during the European Conference on Optical Communication (ECOC) 2026. The presentation and webcast recording are available at PHOTONLINK™ Launch webcast.

(Photo credit: Coherent)

TrendForce 2027 Infrared Sensing and Optical Communication Market Trend
1. Annual Report
Release: 01 January 2027
Format: PDF / EXCEL
Language: Traditional Chinese / English

2. Optical Communications- InP Laser Diode & InGaAs Photodiode Quarterly Price Report
a. InP Substrate- 3-inch
b. EML- 100 / 200G
c. CW-DFB LD- 50 / 70 / 100mW
d. InGaAs Photodiode- 100 / 200G
e. DSP- 800G / 1.6T
Release: 20th of February, May, August, and November, 2027
Format: EXCEL
Language: Traditional Chinese / English