Coherent Corp., the global leader in photonics, today announced PhotonLink™, an integrated optics platform that brings together Coherent’s broad portfolio of critical photonics technologies, precision assembly and test capabilities to deliver complete optical solutions for next-generation AI datacenters. The platform supports co-packaged optics (CPO), near-packaged optics (NPO) and emerging chip to chip connectivity. As AI systems continue to scale, demand for higher bandwidth and lower power is driving optical connectivity closer to compute and switching s...

iReach Corporation, a specialist in Vertical-Cavity Surface-Emitting Laser (VCSEL) technology, today announced that it has raised US$10.8 million in a new funding round. The round was led by Darwin Venture Management, with participation from Taiwan’s National Development Fund and strategic investors from the optical communications sector. The new funding will accelerate the development of iReach’s core wafer-bonded flip-chip VCSEL technology for high-speed optical communications and advanced sensing, while supporting the company’s expansion from...

TrendForce’s latest report, “2027 Infrared Sensing and Optical Communication Market Trend”, shows that rapidly growing demand for data transmission in expanding data center networks is increasing interest in VCSEL-based near-packaged optics (NPO). This technology is favored for its low power usage, easier maintenance, and a mature supply chain. Major companies like Lumentum, Furukawa Electric, Coherent, Broadcom, ams OSRAM, and HiSilicon are investing heavily in R&D. Several VCSEL NPO solutions are expected to launch between 2...

MicroLED-based optical I/O developer Avicena raises $10 million from Korea-based Intervest. Avicena raised $130 million today, with its previous $65 million round B announced last year. In March 2026, Avicena launched an evaluation platform for its microLED optical connectivity using ASIC-based transceivers with integrated microLED, photodetector (PD) and micro-lens arrays connected via a multi-core fiber bundle. The kit integrates 320 microLED data channels operating up to 3.5 Gbps. Last month the company launched a new version of its LightBundle ev...

The 2026 China International Optoelectronic Exposition (CIOE) took place from September 9 to 11 at the Shenzhen World Exhibition and Convention Center. This year’s edition arrived at a pivotal moment as surging demand for AI computing intersects with accelerated advances in scaling optical interconnect technologies from 800G toward 1.6T and 3.2T connectivity. These trends have positioned CPO/NPO/XPO, silicon photonics (SiPh), OCS, and hollow-core fiber (HCF) as the defining themes of the exhibition. 据小编现场直击与展前信息梳理，光迅科技、新易盛...