Toyoda Gosei has developed a new glass-encapsulated ultraviolet LED product with a fully sealed structure.

Toyoda Gosei applied our existing glass-sealed package technology to ultraviolet LEDs in this new product and completely sealed the LED die glass to minimize the impact of gas penetration and moisture on the die. This package can maintain high reliability in many different environments—high temperatures up to 100°C and high temperature and humidity environments (85°C and 85% humidity).*

Toyoda Gosei has developed a new glass-encapsulated UV LED. (All photos courtesy of Toyoda Gosei)

For the ultraviolet LED die used in the product, we applied the gallium nitride crystal growth technology that we licensed during the development of blue LEDs, and raised the light output per LED die by improving the crystal structure.

Toyoda Gosei also used flip chip technology to directly connect the LED die to the substrate to reduce the size, and achieved light output per unit area for 200 mW/mm2. Samples for use in curing light sources for resins, ink, and adhesives will be available in April. 

• Toyoda Gosei conducted a testing (JEITA-ED-4701) according to the Japan Electronics and Information Technology Industries Association standard.

A diagram of Toyoda Gosei's glass-encapsulated UV LED chip structure and specs.