With an Edge in Power Consumption and Color, Mini LEDs will Continue to See Higher Penetration Rates in High-End Display Markets, Says TrendForce

The latest Mini LED and HDR High-End Display Market Report by LEDinside, a division of TrendForce, reveals that Mini LED backlight displays all have a significant advantage in brightness, reliability and performance, as well as a chance to grab a slice of the high-end display market. It may even extend the lifetime of LCDs. It is predicted that Mini LED backlights in 2024 will enjoy penetration rates of 20%, 15% and 10% in the application markets of ITs, TVs and tablets, respectively.

TrendForce points out that, in comparing the features of OLED and Mini LED backlight displays, the local dimming feature of Mini LED backlight displays may rival OLEDs in their ability to contrast colors. Mini LEDs also have more competitive prices when compared to TV and monitor product applications, since Mini LED backlight displays exhibit display effects nearly equal to those of OLEDs, but the power consumption is much lower than OLED. This means that these products give a better value for money.

EPISTAR Develops Fast Transfer Technology to Enter Mini LED Backlight Market

With the rise of Mini LED backlight technology, the original industry chain changes. For example, panel manufacturers AUO and Innolux are both collaborating with their respective LED companies to develop Mini LED backlight modules: AUO has joined hands with Lextar, while Innolux is already working with companies such as AOT and Epileds, developing towards TV, IT, and small- and medium-sized automotive product applications and hoping to keep their competitive edge in LCD products. CSOT, BOE and others have partaken in Mini LED backlights and display businesses by leveraging their edge in product technology and equipment capex. Chip manufacturer EPISTAR has worked with subsidiary Yenrich to release Mini LED light source modules to enter the backlight applications of high-end display.

The key challenges of Mini LED backlight technology are cost, power consumption and die bonding efficiency. In terms of power consumption challenge, as current mounts and heat along with it, efficiency goes down. So far, EPISTAR has offered two different solutions to help customers meet their goal of reducing power consumption or cost. For power consumption, with the decrease of chip size and drive current, customers can improve full-screen power consumption with enhanced backlight dimming zone control. For cost, EPISTAR added innovative reflector with LED chips to increase the beam angle. So far, EPISTAR has been able to produce LED chips with special beam angle from 150 to 170 degrees to reduce the number of LED chips required as well as system production costs.

In addition, with the reduction of LED chip size and the increase in number, LED die bonding is becoming more and more difficult. EPISTAR and subsidiary Yenrich’s self-developed “Fast Transfer on X substrate” can precisely transfer Mini or Micro LED chips in large quantities on a variety of material substrates specified by customers.

TrendForce suggests that innovations in Mini LED backlight technology may bring advantages in display effect, but the new structure also places a heavier burden in costs, and striking a fine balance between the two has become a problem that suppliers along the whole supply chain must work together to solve. The fastest way to reduce costs would be to combine the strengths of relevant suppliers for backplanes, LED chips and driver ICs and module assembly companies and develop Mini LED products with better value. Mini LED chips will play an important role in that process. Chip suppliers turned market leaders and technological vanguards will hold an even greater advantage in the future.


2019 Mini LED and HDR High-End Display Market Report
Release Date: 30 April 2019
Format: PDF
Language: Traditional Chinese / English
Page: 100~112
Quarterly Update: Micro / Mini LED Market Prospective Analysis-Player Movement, New Technology Introduction, and Display Week / Touch Taiwan Exhibit Show Report (April, July, October 2019; 10-15 Pages / Quarterly)

Chapter 1 Mini LED Market Scale Analysis
 2018-2023 Mini LED Output Value Analysis and Forecast
 2018-2023 Mini LED Output Analysis and Forecast
 2018-2023 Mini LED Backlight Display Penetration Rate Forecast
Chapter 2 Mini LED Definition and Application Advantages
 Display Development Trend
 The Origin of Miniaturized LED
 Miniaturized LED Size Definition
 LED Light Source for Display
 Mini LED Backlight Product Highlights
 Mini LED Backlight Product Highlight - Cost
 Mini LED Backlight Product Highlight - Brightness
 Mini LED Backlight Product Highlight - Contrast
 Mini LED Backlight Product Highlight - Reliability
 Mini LED Backlight Product Highlight – Slim
 Comparison on Competitiveness of Various Displays
Chapter 3 Mini LED Backlight Product Application and Trend
 Mini LED Backlight Module Display Processing Cost Structure
 Mini LED - Chip Processing Cost Analysis
 Mini LED – Die Bonding Processing Cost Analysis
 Mini LED - PCB Processing Cost Analysis
 Mini LED - Drive IC Processing Cost Analysis
 Mini LED Backlight Display Application Product Overview
 Mini LED Product Application Specification Overview
 Cellphone Application Market Development Trend
 Cellphone Application Market Cost Trend
 Tablet Application Market Development Trend
 Tablet Application Market Cost Trend
 NB Application Market Development Trend
 NB Application Market Cost Trend
 Automotive Display Application Market Development Trend
 Automotive Display Application Market Cost Trend
 MNT Application Market Development Trend
 MNT Application Market Cost Trend
 TV Application Market Development Trend
 TV Application Market Cost Trend
Chapter 4 Mini LED Technology and Challenge
 Mini LED Technology and Challenge
 Chip-Mini LED Chip Characteristics
 Chip-Mini LED Flip Chip Structure
 Chip-Mini LED Chip Light Shape Characteristics
 Chip-Mini LED Chip Challenge Stepper Image
 Probing and Sorting- Face Challenge Due to the Growth of Usage Volume
 Probing and Sorting- Mini LED Chip Binning Challenge
 Package-LED Package Technology Development Trend
 Package-CSP Classification and Technology Challenge
 Package-Mini LED Classification and Technology Challenge
 Package-Comparison of Difference between Mini LED and CSP
 SMT-Mini LED SMT Overview
 SMT-SMD vs Mini LED Size Comparison
 SMT-Mini LED SMT Problem Analysis
 SMT-Pick and Place Problem Analysis
 SMT-Mini LED Welding Technology Classification
 SMT-Surface Mount Technology-Solder Paste Process
 SMT-Solder Paste Processing Problem Analysis
 SMT-Surface Mount Technology-Metal Eutectic Process
 Color Conversion-Wide Color Gamut Display Solution Trend
 Color Conversion-Wide Color Gamut Display Solution Specifications
 Color Conversion- QD Backlight Display Technology Structure
 Color Conversion-QD Backlight Technology Development Trend
 Backplane-Display Backplane Structure
 Light Source Backplane- Material and Drive Mode Classification
 Light Source Backplane-Glass Substrate and Switch Component Characteristics
 Light Source Backplane- Comparison of Difference of PCB Substrates
 Light Source Backplane- Comparison of Backplane Technology Differences
 Drive-Mini LED Active and Passive Drive Analysis
 Drive-Mini LED Passive Drive Classification
 Drive-Mini LED Passive Drive Light Source Module-Scan Mode
 Drive-Mini LED Passive Drive Partition Drive IC Volume Evaluation
 Drive-Mini LED Active Drive Light Source Module
 Light Processing- Challenge in Uniformity of Mini LED Backlight
 Light Processing- Calibration of Mini LED Backlight Display Disuniformity
 Light Processing- Differential Analysis in Mini LED Image Splicing
 Thinning- Evolution of Mini LED Backlight Display Light Source
 Thinning- Mini LED Backlight Display Development Trend
 Thinning- Trends in the Thinning of Mini LED Backlight Displays
 Thinning- Challenge of Mini LED Backlight Display Thinning
Chapter 5 Mini LED Key Manufacturer News Analysis
 Mini LED Backlight Supply Chain Analysis
 Mini LED Sorting and Binning Equipment Manufacturer-SAULTECH
 Mini LED Die Bonding Equipment Manufacturer- ASM Equipment and Inspection Solution
 Mini LED Die Bonding Equipment Manufacturer- ASM in Industry 40
 Mini LED Die Bonder Equipment Manufacturer-K&S
 Mini LED Die Bonder Equipment Manufacturer-Rohinni
 Mini LED Light Source Backplane Manufacturer-UNIFLEX
 Mini LED Drive IC Manufacturer-Macroblock
Chapter 6 Mini LED Supply Chain and Manufacturer News Analysis
 Mini LED Backlight Application Products Overview
 Global Major Mini LED Backlight Manufacturers’ Supply Chain Analysis
 Regional Manufacturer News Analysis-Taiwan Companies
 Regional Manufacturer News Analysis - Mainland Chinese Companies

Further information, please contact:


Global Contact: 




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Eric Chang

Paula Peng

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