SÜSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the new Mask Aligner MA200 Gen3. The tool is designed for high volume manufacturing and can be used for exposing wafers with a diameter of up to 200 mm. This latest generation tool is a further development of the very successful MA200 Compact platform, of which the 100th tool was recently delivered to a customer.