2015-05-06

Samsung Electronics Unveils Ultra-Compact LED Chip Scale Packaging Technology at LIGHTFAIR International 2015

Samsung Electronics, a world leader in advanced component solutions, today introduced advanced chip scale packaging (CSP) technology for use in a diversity of LED lighting applications at LIGHTFAIR International 2015, being held in New York, May 5-7.
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2015-05-05

Samsung Outlines Approach for Smart Lighting at LIGHTFAIR International 2015

Samsung Electronics Co. Ltd., announced today that it will demonstrate for the first time, the company's new open, secure, and connected platform for smart lighting at LIGHTFAIR International 2015, being held in New York, May 5-7.
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2015-02-25

LIGHTFAIR® International 2015 Celebrates the International Year of Light

Lighting and design professionals from around the world will converge for networking opportunities, presentations by industry thought-leaders and event experiences at LIGHTFAIR® International (LFI®)—the world’s largest annual architectural and commercial lighting trade show and conference.  LFI takes place May 3-7 at New York’s Javits Center (Pre-Conference LIGHTFAIR Institute®: May 3-4; Trade Show & Conference: May 5-7).
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ViewSonic Corp., a leading global provider of visual solutions, brought its cutting-edge display technologies to 2025 Creative Expo Taiwan, transforming art into immersive visual experiences. The theme for 2025, Water Scapes, celebrated Taiwan... READ MORE

A jointly developed demonstrator from ams OSRAM and DP Patterning points to where automotive lighting networks are heading: single-layer flexible printed circuit boards (FPCBs) instead of complex multilayer designs — and, in the structur... READ MORE