2015-04-07

Wafer Level Chip Scale LED Package Jumping over Flip Chip CSP LED

No more packaging – Package-less Package. That is the fundamental solution which LED manufacturers are looking for to meet the market demands. Unfortunately, the era of Flip Chip-Chip Scale LED Package (FC CSP LED) is, however, emerging. It will make the time of the wide spread of LED light coming slowly step by step. Any LED manufacturers who aggressively jump over FC CSP LED and current leading-edge packaging technologies would be expected under the paradigm of no more packaging. A little of endeavour has been conducted to fulfil package-less package like Phosphor on Die and Package Free Chip.
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