2015-06-22

Dow Corning: CSP LED to Drive Next Generation LED Package Development

CSP technology will lead the emergence of new LED package material demands, said Kaz Maruyama, Global Marketing Director, Dow Corning Lighting Solutions at LEDforum 2015 Guangzhou, which took place earlier this month at China Import and Export Fair Pazhou Complex in Guangzhou, China.
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Precision and reliability are becoming increasingly critical in modern vehicle systems, especially as the automotive industry accelerates toward the electrification of mobility. Electric vehicles are generally heavier than combustion engine ve... READ MORE

Everlight Electronics Co., Ltd. (hereinafter “Everlight”) filed a patent infringement lawsuit against Seoul Semiconductor Co., Ltd. (hereinafter “SSC”) in the United States District Court for the Eastern District of Texas ... READ MORE