2015-07-07

OEM Group Expands Wafer Surface Preparation for LED Automotive Lighting Manufacturers

Global semiconductor capital equipment manufacturer OEM Group announced today it has received first-in-fab and repeat tool orders for its Cintillio™ wet chemical processing system from several leading Ultra Bright LED manufacturers working in the automotive lighting market.  With these orders, OEM Group has now successfully expanded its production proven and patented ECO-Process wafer surface preparation solutions from the established markets of Power Device, CMOS IC, and MEMS manufacturing into UBLED fabrication, a new market for Cintillio™.  The tools will be used for ozone processing of some of the most sensitive layers exposed during LED manufacturing, including exposed silver, which to date has presented LED makers with difficult challenges where surface preparation is involved.
Continue reading
ams OSRAM, a global leader in innovative light and sensor solutions today held a roundtable forum spotlighting new opportunities with high precision illumination characterization. The event brought together experts from industry, academia, and... READ MORE

ams OSRAM introduces the new generation of the NIGHT BREAKER LED SPEED H7 and the first NIGHT BREAKER LED SPEED H4 which is another milestone in the field of LED retrofit lamps. Both road-approved¹ retrofit solutions carry the addition up... READ MORE