2019-06-21

TriLumina Launches the World’s First Surface-Mount Flip-Chip Back-Emitting VCSEL Array

TriLumina announced the launch of a surface-mount flip-chip back-emitting VCSEL array without the need for a submount or bond wires, allowing lower costs and higher performance than existing designs using near-infrared light-emitting laser diodes or LEDs for 3D sensing. Conventional VCSEL arrays are mounted on a submount and use bond wires for electrical connections. TriLumina’s back-emitting VCSEL technology has been flip-chip packaged and used in automotive long-range LiDAR prototypes, for low power mobile and in-cabin 3D sensing applications. (Im...
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2017-12-20

TriLumina to Demonstrate 3D Solid-State LiDAR Using Its 3D Sensing VCSEL Illumination Solutions

At CES 2018, TriLumina will demonstrate multiple use cases for its innovative 940 nm VCSEL illumination modules, including a novel solid-state 3D LiDAR system powered by its illumination modules, which will be showcased at the company's Suite at the Westgate Hotel as well as in the Leddar Ecosystem Pavilion.
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Natural colour rendering of Optisolis™ LEDs lets visitors experience artwork as the artist intended without degrading the work. Tokushima, Japan – 23 July 2019: Nichia Corporation, the leader in high brightness LED technologies, an... READ MORE

TSLC Corporation, a subsidiary of SemiLEDs, launched sampling of its tri-color Mini LED series, targeted to provide LED display manufacturers with surface-mounting (SMT) compatible devices. The first product in the tri-color multi pixel series... READ MORE