Touch Taiwan 2026 focuses on three main topics: Micro LED optical communications, Micro LED interactive / transparent displays, and Mini LED-backlight displays.

Ennostar
Ennostar is proactively implementing its dual value-added engine strategy, driving progress in scenario-based and solution-based developments. To strengthen its competitive edge in the optical semiconductor industry, “3+1” high value-added applications are highlighted, including automotive LED, advanced displays, smart sensing, and optical communications. Ennostar is accelerating its expansion into the optical communication market by developing a comprehensive portfolio of light sources for short, medium, and long distance transmissions, including Micro LED CPO solutions, VCSELs, and CW-DFB LDs.

• Short Distance (≤10 m): Ennostar has successfully integrated high-speed photodiodes from Tyntek to launch its Micro LED CPO solutions. By introducing glass RDL interposers, customers can implement the solution directly, eliminating the need for additional mass transfer facilities.
• Medium Distance (≤100 m): Ennostar’s 850 nm VCSEL technology has achieved 56 Gbps PAM4 performance.
• Long Distance (500- 2,000 m): The company is manufacturing CW-DFB LDs on 2-inch InP epi-wafers, achieving a power output of 70mW.

To meet the market demand for ADB headlights, Ennostar features headlight modules that integrate both optical and electrical thermal management. An 84-pixel matrix LED headlight module with a spacing of just 60µm, successfully addressing optical crosstalk issues. For low-pixel full-color illumination, the company utilizes 2,500 RGB Micro LEDs to enable ground projection.

The P0.8 Mini LED communication displays leverage Mini LED COB technology and are slated to be adopted by European and American car makers. For autonomous driving system (ADS) marker lamps, Ennostar has provided Cyan chips (492nm) and PC Cyan solutions; the former boasts high color purity and low-voltage operation.

Ennostar introduced a new backlight LED package solution. To deliver wide color gamut display effects, most manufacturers combine blue LEDs with red and green phosphors. By comparison, Ennostar’s solution enables blue and green emission on a single chip, requiring only red phosphors to achieve 100% Adobe RGB coverage. This solution features higher color accuracy than regular edge-type backlights (left), making it ideal for high-end displays used in professional photography, printing, and design. It also covers a broader range in the green and cyan spectrums than sRGB, ensuring color consistency between displays and prints.

With Ennostar’s Mini LED COB technology, Mini LED automotive displays can achieve an optical distance below 2.5mm through local dimming.

Smart Sensing: A Pillar of Ennostar’s “3+1 Strategy”

• True Wireless Stereo (TWS): Besides offering SWIR LEDs and InGaAs photodiodes, which have been adopted by US and Korean brands, Ennostar delivers the industry’s smallest integrated PPG sensor SiP modules, which can measure heart rate, blood oxygen, and temperature without compromising earbud comfort and appearance.
• Smart Rings: To minimize red glow effects, Ennostar launched 660nm VCSELs for smart ring applications.
• While VCSELs feature a beam divergence of 20° to 30°, Ennostar has introduced PCSEL package solutions that achieve a much tighter 1.5° directivity for applications requiring smaller beam patterns.
• Gas Sensing: Ennostar launched eSWIR LEDs that can detect wavelengths up to 2,500nm for special gas detection.

Aledia
Aledia uses its FlexiNOVA technology to group nanowires into parallel blocks and run them in a serial configuration, resulting in a Micro LED chip measuring 15x30µm² and operating at 9V. This design significantly reduces power consumption, marking a leap for Micro LED technology to expand from high-end applications to the mass consumer market.

Aledia’s µLink technology develops optical communication solutions using FlexiNOVA technology. By using m-plane GaN for light emission, Aledia achieves a 10x higher bandwidth than traditional Micro LED solutions at the same current density. The next step is to launch its second-generation solutions featuring smaller chip sizes and pitches.

Aledia has been advancing its monolithic full-color solutions for near-eye displays. By adjusting the diameter of nanowires, photonic crystals can achieve color conversion among all three colors of light at the pixel level, thereby creating monolithic RGB microdisplays. This approach is an ideal alternative to the three-layer XCube solution, which is power-intensive and bulky.

Coherent
At Touch Taiwan 2026, Coherent revealed a scaled-up 3.2 Tbps, 32-lane version that also incorporates 100 Gbps/Lane VCSELs and photodiodes, along with a demonstration of a 32-lane CW-DFB LD optical engine operating at 200 Gbps/Lane for SiPh CPO applications.

PlayNitride
PlayNitride leverages its own Tantium high-voltage chip design (dual cell), enabling a 50% reduction in power consumption of Micro LED watches at 5,000-nit brightness through serial LED configurations and circuit equalization. This achievement opens the door for more applications operating under high ambient brightness.

PlayNitride launched a 0.18-inch Micro LED display, featuring a peak brightness of 500,000 nits (B μLED + QD) and a wide color gamut covering 90% of DCI-P3. This new model comes with a new CMOS backplane design, a resolution of 720×720, and a pixel density of 5,644 ppi, making it poised for commercial adoption. Moving forward, the company aims to introduce this microdisplay into AR glasses to address the need for lightweight and high-performance devices.

AUO
The 54-inch Transparent Micro LED Signage, featuring high brightness and transparency, is a smart information display board that can be modularly spliced into different sizes. This makes it versatile for use in flagship stores, exhibition venues, and other settings.

The 30-inch Interactive AR Box combines 3D product visualizations with facial recognition and gesture sensing. It is suitable for high-end and limited edition product displays, allowing consumers to rotate and zoom in on product details in mid-air. This enables a detailed exploration that closely approximates handling the actual item without the need to physically touch it.

For exposure of brand marketing in common sports event venues, the 64-inch Sports AR Solution provides an interactive application between live events and a transparent Micro LED display. Currently, it uses an 8-panel (2x4) configuration with 16.1-inch splicing, supporting both front and rear installation. Micro LED chips can be supplied by Ennostar and PlayNitride.

Using NIL to imprint grating structures on glass substrates can enable full-color displays through a two-layer structure and deliver up to 1,500 nits/lm of optical efficiency over a 25°~30° FOV. This approach is also compatible with different optical engines. At present, low-volume production lines are available, and collaborative projects with Avegant and Himax have been initiated.

InnoLux
At Touch Taiwan 2026, Innolux showcased its vision of integrating technology into life by moving beyond the hardware spec race and demonstrating real-life applications and performance for product deployment.

The 7.02-inch model is used in drone displays, supporting 576 Mini LED dimming zones. With low power consumption, high contrast, and high brightness, it increases outdoor image sharpness and extends hours of use.

The 13.3-inch model is applied to aircraft cabin infotainment displays, featuring 1,536 Mini LED dimming zones, featuring an ultra-slim 1.8mm profile, an incredibly light weight of 160g, and an extended lifespan exceeding 50,000 hours. These advantages enable the product to meet the requirements of aircraft payload reduction, fuel management, and lower maintenance costs.

The 17.3-inch model has been introduced to marine navigation applications. With 1,440 Mini LED dimming zones, this product supports a wide range of brightness levels from 0.001 nits to 1,500 nits, alongside a high contrast ratio and local dimming control. The 17.3-inch model has been introduced to marine navigation applications. With 1,440 Mini LED dimming zones, this product supports a wide range of brightness levels from 0.001 nits to 1,500 nits, alongside a high contrast ratio and local dimming control.

Rapitech / Instrument Systems
Instrument Systems’ LumiTop X3 can be applied to AR glasses display testing. Its specialized AR lenses enable simulations of different human-eye pupil sizes, measuring various key metrics, including brightness, uniformity, luminance, PPD, FoV, distortion, sharpness, and focus distance.

Rapitech collaborated with Instrument Systems to co-develop the RAM, RTS, and MRS systems, meeting all the testing requirements across various stages in Micro LED processes.

The RAM system is used to evaluate wafers and display panels at various viewing angles, thereby eliminating the side-view inconsistencies in color and brightness found in tiled displays and smart watches. Simultaneous measurements at multiple angles allow the production line to obtain angle-specific characterization of the entire panel and identify defective dies at an early stage.

The RTS system is the only commercially available Micro LED automated contactless inspection system designed for full inspection of all pixels, enabling both pre- and post-inspection of wafers and panels in mass transfer processes. Measurements of brightness, dominant wavelength, color, and chromaticity can be obtained from each die, thereby effectively reducing production costs.

The MRS system has iterated to the second generation to align with the needs of the G4.5 production line. This laser-based repair system can retrieve the results of automated measurements from the previous station and streamline defect repair assessments using built-in AI tools. This fully automated repair process can minimize manual control and operational complexity.

MSP+
For Micro LED-based CPO applications, Micraft System Plus launched a series of new products, including Micro LED mass transfer equipment that has improved precision from ±3 µm to ±1 µm for display applications. This upgrade meets the stringent demand for manufacturing precision in Micro LED CPO solutions.

Leveraging its expertise in wafer-level optics, the company has developed optical packaging equipment to provide all-encompassing optical integration capabilities In terms of optical coupling and testing, the company incorporates a critical six-axis motion control technology and develops in-house algorithms to enable precise and fast calibration of optical paths. These solutions will assist customers in product verifications and developments.

For advanced packaging, MSP+ has simultaneously released several essential equipment models, including thermal compression bonding (TCB) systems for advanced packaging processes such as CoWoS and HBM, as well as laser assisted bonding (LAB) systems, which have now been implemented in fan-out PLP applications and are undergoing verification by customers.

MSP+ has also invested in hybrid bonding technologies, where its core competitiveness is embodied by the integration of motion control, laser applications, and process development. Equipped with full in-house capabilities encompassing hardware design, software development, and process integration, the company can also address customer needs promptly and provide on-the-fly solutions and verification services.

Author: Emerson, Joanne, Estelle / TrendForce

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