2018-11-22

ams Works with Qualcomm to Develop 3D Depth Sensing Camera and Debuts Sensor Module for Bezel-Less Smartphones

ams, a high performance sensor solutions provider, has cooperated with Qualcomm Technologies to focus on the development of a 3D depth sensing camera solution for mobile phone applications such as 3D imaging and scanning and biometric face authentication. The two companies aim to dedicate their technology expertise and engineering force to design a 3D stereo camera solution for Android-based mobile phones. ams provides its VCSEL light sources and optical IR pattern technology on the base of Qualcomm’s Snapdragon™ Mobile Platforms to suppourt various applicati...
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Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE