ams Works with Qualcomm to Develop 3D Depth Sensing Camera and Debuts Sensor Module for Bezel-Less Smartphones

ams, a high performance sensor solutions provider, has cooperated with Qualcomm Technologies to focus on the development of a 3D depth sensing camera solution for mobile phone applications such as 3D imaging and scanning and biometric face authentication.

The two companies aim to use their technology expertise and engineering force to design a 3D stereo camera solution for Android-based mobile phones. ams provides its VCSEL light sources and optical IR pattern technology on the base of Qualcomm’s Snapdragon™ Mobile Platforms to suppourt various applications.

Keith Kressin, senior vice president of product management at Qualcomm Technologies, said, “Qualcomm Technologies is committed to providing active depth camera solutions to our customers. We’re excited to work with ams on the development and commercialization of this reference design with the goal of bringing these depth sensing solutions to consumers in the future.”

(Image: ams)

ams has also launched a 1.44mm-wide integrated color/ambient light/proximity sensor module which fit the design of narrow-bezel mobile phone. The module will enable manufacturers to better optimize automatic disabling of smartphone touch screens during calls and the adjustment of screen brightness to ambient conditions for more comfortable and lower-energy smartphone use.

“Today’s smartphone industrial design trend of maximizing a display screen size by increasing its screen-to-body ratio and minimizing the bezel area calls for the smallest module solution. The TMD3702VC with its ultra-small form factor facilitates this need, helping to almost eliminate the bezel on the display’s face,” said Dave Moon, Senior Product Marketing Manager at ams.

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