2013-02-19

Philips Introduces Die-Level LUXEON Flip Chip LED Technology

Philips Lumileds has announced new LUXEON Flip Chip LED devices that will enable the next generation of lighting applications by providing luminaire manufacturers with more design flexibility. Users can now access Philips Lumileds technology through a robust LUXEON Flip Chip die format giving them greater design options than in the past. “Now luminaire manufacturers can enjoy the best of both worlds, by either incorporating packaged LEDs as they did in the past, or by starting with the LED die and customizing the phosphor and packaging to best suit ...
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Silanna UV is pleased to announce the release of its next generation Far UVC LED, the SF2-3T9B5L1-TB, which exceeds even the popular SF1 series, with UVC wavelengths down to 230nm (typical 233nm); doubled output power; and 2x improvement in te... READ MORE

As automotive design continues to evolve, the demand for sleek, distinctive front lighting has never been greater. Thin, continuous light lines are becoming a defining element of vehicle identity, balancing aesthetics with functionality. In re... READ MORE