Hi, https://www.trendforce.com/member/personal Member Center | Contact Us RSS facebook google+ twitter linkedin mobile web     CN TW EN

Home > SSL Fellow George Craford
2013-09-17

Philips Discusses Future Developments in Packaging

The advancement in LED wafer and packaging technology and continual decrease in price is the driver for the upcoming lighting era. Philip SSL Fellow George Craford pointed out that LED packaging component prices have been dropping following the increase in energy efficiency.
Continue reading →
Weekly Top7
Monthly Top7
FEATURED PRODUCTS
[News] Silanna UV Expands Industry-Leading UV-C LED Portfolio with New TO-39 Flat Window Package for SF1 and SN3 Series
Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE
[News] Ennostar Showcases Micro LED Optical Communication for High-Speed AI Data Center Interconnects with AUO and Tyntek

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE

PRESS RELEASE