As 2013 comes to a close, LED lighting demands have sky rocketed. The industry has finally gotten past two years of harsh winters to welcome a warm spring. While LED upstream manufactures have been busy with flip-chip technology, LED package manufacturers have not been idle either. Introducing EMC lead frames into package manufacturing process has become the main target for many manufacturers.
The TMF8829 direct Time-of-Flight (dToF) sensor significantly increases resolution — from the previously common 8×8 zones to 48×32 — and it is designed to detect subtle spatial differences and distinguish closely spaced... READ
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Introducing the New J Series® 3030S 3V & 6V LEDs
Cree LED is expanding the proven J Series 3030 portfolio with four new high-performance LEDs that combine a 757-footprint with outstanding efficacy and drop-in compatibility with popula... READ
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