2013-12-27

2013 Review: EMC Production Expansion Could Mean Trouble for PCT

As 2013 comes to a close, LED lighting demands have sky rocketed. The industry has finally gotten past two years of harsh winters  to welcome a warm spring. While LED upstream manufactures have been busy with flip-chip technology, LED package manufacturers have not been idle either. Introducing EMC lead frames into package manufacturing process has become the main target for many manufacturers.
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Silanna UV is pleased to announce the release of its next generation Far UVC LED, the SF2-3T9B5L1-TB, which exceeds even the popular SF1 series, with UVC wavelengths down to 230nm (typical 233nm); doubled output power; and 2x improvement in te... READ MORE

As automotive design continues to evolve, the demand for sleek, distinctive front lighting has never been greater. Thin, continuous light lines are becoming a defining element of vehicle identity, balancing aesthetics with functionality. In re... READ MORE