Dow Corning’s New Dispensable Thermal Pads Raise Performance, Lower System Costs for LED Lighting Applications

Source: Courtesy of Dow Corning


Dow Corning, a global leader in silicones, silicon-based technology and innovation,today introduced to the Asian market new Dow Corning® Dispensable Thermal Pads, an innovative newtechnology developed for more cost-effectivethermal management in LED lighting applications. The new silicone materials now enable LED lamp and luminaire manufacturers to quickly and precisely print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes, while ensuring excellent thermal management properties and reduced manufacturing costs. Dow Corning announced the newdispensable thermal pads here at the 18thGuangzhou International Lighting Exhibition 2013 (Hall 3.2, booth #D36) as part of a global new-product launch, showcasing the company’s technological leadership in the global lighting industry.
“New Dow Corning Dispensable Thermal Pads are a valuable addition to our already broad portfolio of industry-leading thermal management silicone solutions,”said Yvonne Dong, global marketing manager, Lamp & Luminaire Assembly at Dow Corning.“They are a perfect example of how Dow Corning closely monitors industry-wide light and luminaire trends toproactively innovatenewer and better materials and manufacturing solutions to meet our customers’ most critical needs—especially driving down system costs and providing greater design and manufacturing flexibility vs. traditional fabricated thermal materials.”

According to Dow Corning, demand for higher-performing more cost-effective LED thermal management is expanding as lamp and luminaire applications become increasingly sophisticated.Thecompany’s new technology addesses this demand. Specifically, it offers the potential to reduce material costs by 30 to 60 percent by eliminating the waste more common to conventional fabricated thermal pads, enhancing thermal performance and accelerating manufacturing cycles.The materials can be applied via standard screen or stencil print processes, or with standard dispensing equipment. Either way, the new dispensable pad technology easily conforms to complex and unevenly shaped substrates and cures in place to help increase throughput and provide greater flexibility over deposited layer thickness.

Dow Corning’s new thermal management product line encompasses four grades, distinguished by varying levels ofthermal conductivity with or without controlled bond line thicknesses. Dow CorningTC-4015 and TC-4016 Dispensable Thermal Pads offer thermal conductivity of 1.5 W/mK, andDow CorningTC-4025 and TC-4026 Dispensable Thermal Pads offer higher 2.5 W/mK thermalconductivity. Two grades,Dow Corning TC-4016 and TC-4026 Dispensable Thermal Pads, incorporate glass beads to offer improved control over bond line thickness.

All products in Dow Corning’s new product line bond well with common lighting substrates like aluminum and printed circuit boards. Plus, because they eliminate the fiberglass carrier used for conventional fabricated pads, Dow Corning’s new solution offers lower thermal resistance, excellent compression and consistently reliable, high-quality thermal management over the lifetime of an LED lamp or luminaire.

Dow CorningDispensable Thermal Pads are among the highlighted products at Dow Corning’s boothwhere visitors can view samples of the technology and learn more from the company’s LED lighting experts.Dow Corning Dispensable Thermal Pads are available from Dow Corning worldwide.


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