2014-06-03

3M Launches New LED Chip Package Substrate an Alternative to Ceramic

3M Electronics Materials Solutions Division today announced the launch of its new 3M™ LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic substrates. The new substrate, constructed of copper and polyimide, is able to meet the electrical and thermal performance required of high-power LED chips at a competitive price compared to high performance ceramic substrates. 3M offers the substrate in a tray and a reel format. 
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Tokushima, Japan – 17 June 2022: Nichia, the world’s largest LED manufacturer and inventor of high-brightness blue and white LEDs, announces the addition of the Direct Mountable Chip Series (Part Number: NVSWE21A-V1) to the portfol... READ MORE

DURHAM, N.C.--(BUSINESS WIRE)--Cree LED, an SGH company (Nasdaq: SGH), announced today the launch of XLamp® Element G LEDs, delivering a new product class with unmatched light output and efficiency for LEDs of this size. The... READ MORE