2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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Absen Europe has opened a group buying promotion for the SA1.5, the latest evolution of its Saturn Series, available exclusively to European rental and staging companies through 30th September 2026. The programme gives partners the ability to bui... READ MORE
 ViewSonic Corp., a leading global provider of visual and EdTech solutions, is showcasing its expanding AI-enabled learning applications and integrated visual solution ecosystem during the week of COMPUTEX (June 2–5) at its R&D cente... READ MORE