2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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International automotive supplier FORVIA HELLA has fully localized its digital, high-resolution headlamp system SSL | HD in China for the first time in the context of a new series project. Both series development as well as manufacturing take ... READ MORE

Heart rate, blood flow, and other physiological metrics have been central to health monitoring for decades. However, numerous relevant changes in the human body develop insidiously over time and may go undetected when relying on single measure... READ MORE