2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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At InfoComm 2026 in Las Vegas, Daktronics of Brookings, South Dakota, and Grass Valley were presented the rAVe Pubs Best Solution for Large Venue or Live Events Award. The recognition was presented at the show and highlights the companies&rsqu... READ MORE
GreenTech 2026 in Amsterdam once again demonstrated how dynamically the international horticulture industry is evolving. Many discussions centered on solutions for greater energy efficiency, new approaches to plant care, and the growing integr... READ MORE