2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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Cars are becoming increasingly intelligent. However while driver assistance systems and sensors have long focused primarily on what happens outside the vehicle, attention is now shifting inside. In-Cabin Sensing represents a new generation of veh... READ MORE

Nichia, the world's largest LED/Laser Diode manufacturer and inventor of the high-brightness blue and white LEDs, and Tokushima Agriculture, Forestry and Fisheries Technology Support Center have conducted a joint research study to evaluate... READ MORE