2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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Samsung today announced a new edition of its large-format LED display, The Wall, marking a pivotal expansion to its Chip on Board (CoB) lineup. Like earlier models of The Wall, the MPF series optimizes viewing experiences across an array of en... READ MORE

Cree LED, a Penguin Solutions brand (Nasdaq: PENG), today announced that it has filed a patent infringement lawsuit in the United States District Court for the Northern District of Illinois against Promier Products and Tractor Supply. The laws... READ MORE