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2017-01-06

Telink Semiconductor’s RF SoC Passes ZigBee 3.0 Certification Tests

Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK (software development kit) to its customers.
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[News] VueReal Expands Reference Design Kit Portfolio with Industry-Specific Bundles to Accelerate MicroLED Commercialization

VueReal, the pioneer of MicroSolid Printing™, today announced a significant expansion of its Reference Design Kit (RDK) portfolio with new industry-specific bundles. Purpose-built for automotive and consumer electronics, the vertical RDK... READ MORE

[News] ViewSonic Launches Second Generation All-in-One, Mobile, Direct View LED Display Solution Kit

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