EV Group and Leti completed the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron).
Whether it is a family summer holiday, a weekend trip with the camper or a long drive down south: for many people, the car remains the most popular means of transport for their vacation. To make sure the journey doesn’t end in a traffic ... READ
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Samsung Electronics has today announced it’s teamed up with Twickenham Film Studios (TFS) and award-winning Virtual Production (VP) experts Quite Brilliant (QB) that will see Samsung’s cutting-edge VP technology housed at Twickenha... READ
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