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2017-11-14

Leti Demonstrates World’s First 300 mm Wafer-to-wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

EV Group and Leti completed the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron).

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[News] Daktronics Partners with American Association of Professional Baseball to Connect Students with Real-World Career Game-Day Experience

Daktronics of Brookings, South Dakota, has partnered with the American Association of Professional Baseball (AAPB) as its official video display and control equipment provider to bring education and professional sports together. “This pa... READ MORE

[News] Nichia Innovation Gallery Staged During Light + Building Week as Part of Wider Milestone Year

As Nichia marks the key milestones of 70 years in business and 30 years since pioneering the white LED, its European division has organized a two-day, invite-only Innovation Gallery. Held on 10 and 11 March at Bernhard Knaus Fine Art, a presti... READ MORE