2021-10-15

Youngwoo DSP to Develop MicroLED Package

Youngwoo DSP said on Wednesday that it has chosen to lead a national project to develop a new MicroLED package technology. The project given by South Korea’s Ministry of Trade, Industry and Energy is aiming to develop an ultra-small RGB layer based MicroLED manufacturing technology. The project will be given a 25.36 billion won budget and will last until December 31, 2024. The technology aims to transfer LED chips at the wafer level. This technology will allow for the production of a 360ppi resolution display panel. Youngwoo DSP said the ...
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What Is WICOP Technology? The Evolution of WICOP 1, 2 and 3 by Seoul Semiconductor From Package-Free Opto-Semiconductors to High-Voltage Operation and Rare-Earth-Free White Light WICOP (Wafer Integrated Chip on PCB) is a package-free opto-semi... READ MORE

ViewSonic Corp., a leading global provider of visual and edtech solutions, announced that the LDS136-152 Mobile Direct View LED Display Solution has been awarded Pro AV Best in Market Award from AV Technology, Systems Contractor News, and Soun... READ MORE