2021-10-15

Youngwoo DSP to Develop MicroLED Package

Youngwoo DSP said on Wednesday that it has chosen to lead a national project to develop a new MicroLED package technology. The project given by South Korea’s Ministry of Trade, Industry and Energy is aiming to develop an ultra-small RGB layer based MicroLED manufacturing technology. The project will be given a 25.36 billion won budget and will last until December 31, 2024. The technology aims to transfer LED chips at the wafer level. This technology will allow for the production of a 360ppi resolution display panel. Youngwoo DSP said the ...
Continue reading
Samsung today announced a new edition of its large-format LED display, The Wall, marking a pivotal expansion to its Chip on Board (CoB) lineup. Like earlier models of The Wall, the MPF series optimizes viewing experiences across an array of en... READ MORE

Cree LED, a Penguin Solutions brand (Nasdaq: PENG), today announced that it has filed a patent infringement lawsuit in the United States District Court for the Northern District of Illinois against Promier Products and Tractor Supply. The laws... READ MORE