2009-07-09

QFN Packaging Solves The Heat Dissipation Problem of LED Display

QFN Packaging Solves The Heat Dissipation Problem of LED Display Currently, almost all LED display manufacturers face the problem of heat dissipation during PCB design, with the thermal effect of drivers disturbing the normal light emitting property of LED and further influencing the color uniformity of the overall display. This article will illustrate how headaches can be prevented by changing the packaging of driving chips.
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ams OSRAM is launching two new variants of the SIRIUS HRI® series for entertainment lighting. The compact Galaxy 250 and 20D short-arc HID lamps combine exceptional brightness, longer service life, and outstanding performance. Precise 2&de... READ MORE

Following the successful launch of the NIGHT BREAKER LED SMART ECE H11 for headlights, ams OSRAM (SIX: AMS) is continuing its series of innovative LED retrofit solutions. In addition to the new NIGHT BREAKER LED C5W ECE, the first ECE R37-appr... READ MORE