2009-07-09

QFN Packaging Solves The Heat Dissipation Problem of LED Display

QFN Packaging Solves The Heat Dissipation Problem of LED Display Currently, almost all LED display manufacturers face the problem of heat dissipation during PCB design, with the thermal effect of drivers disturbing the normal light emitting property of LED and further influencing the color uniformity of the overall display. This article will illustrate how headaches can be prevented by changing the packaging of driving chips.
Continue reading →

<iframe allow="accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share" allowfullscreen="" frameborder="0" height="315" referrerpolicy="strict-origin-when-cross-origin" src="https://www.youtube.co... READ MORE

France-based car maker Peugeot unveiled a new concept car, the Peugeot RCZ Vision, building on the company's 2009-2015 RCZ coupe - with a host of new technologies. The RCZ Vision, build on Stellantis' STLA One architecture, is an ele... READ MORE