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2009-07-09

QFN Packaging Solves The Heat Dissipation Problem of LED Display

QFN Packaging Solves The Heat Dissipation Problem of LED Display Currently, almost all LED display manufacturers face the problem of heat dissipation during PCB design, with the thermal effect of drivers disturbing the normal light emitting property of LED and further influencing the color uniformity of the overall display. This article will illustrate how headaches can be prevented by changing the packaging of driving chips.
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[News] Bowling Green State University Set to Unveil New Daktronics Display at Doyt Perry Stadium

Daktronics of Brookings, South Dakota, was selected by Bowling Green State University (BGSU) to manufacture and install a new LED video display at Doyt Perry Stadium in Bowling Green, Ohio. The installation will be completed ahead of the fall ... READ MORE

[News] Field of Dreams Ballpark Gets Digital Feature with Daktronics LED Display

Daktronics of Brookings, South Dakota, has manufactured and installed an LED video board in the outfield of Field of Dreams Ballpark in Dyersville, Iowa. The new facility is adjacent to the famed corn field-framed ballpark from the iconic 1989... READ MORE

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