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2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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[News] “Defying Boundaries To Celebrate Creativity” — Highlights From Art Basel in Basel 2025
From June 19 to 22, 2025, Samsung Electronics will collaborate with globally renowned artists to celebrate global diversity, artistic innovation and the power of display technology at Art Basel in Basel 2025, the world’s largest art fair he... READ MORE
[News] Macroblock at InfoComm 2025: Unveiling the DaVinci Series for an Immersive Visual Experience

(June 13) Macroblock participated in the annual event InfoComm 2025 held at the Orange County Convention Center in Florida, USA from June 11 to 13, 2025. Macroblock invited customers to visit the booth with the theme of "Meet with Macrobl... READ MORE

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