MH&W International-LEDinside

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2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.

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1 [News] Symbol of Unity: LEDVANCE Brings Johannesburg’s Nelson Mandela Bridge Back to Life
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[News] Symbol of Unity: LEDVANCE Brings Johannesburg’s Nelson Mandela Bridge Back to Life

Civic engagement combined with an innovative solar lighting concept from LEDVANCE has made the Nelson Mandela Bridge – one of South Africa’s most important landmarks – safe and visible once again. In just three weeks, LEDVANCE, ... READ MORE

[News] Reliable Capacitive Sensing for Demanding Automotive Environments

Premstaetten, Austria, and Munich, Germany (September 18, 2025) In automotive electronics, reliability is a key design criterion. Capacitive sensors are widely used in exterior and interior vehicle applications—from touch-based door hand... READ MORE

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