2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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ams OSRAM, a global leader in innovative light and sensor solutions today announced at Laser World of Photonics China (LWPC) 2026 a portfolio of laser products powered by its latest blue multi-mode laser chips. The company also presented, for ... READ MORE

The introduction of the new Audi Q3 marks significant technological progress in how digital lighting systems are integrated into the Audi compact segment. EVIYOS HD25 is an advanced, pixel-based lighting solution developed by ams OSRAM. It is ... READ MORE