2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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The transition from halogen to LED technology is becoming even easier: ams OSRAM expands its portfolio of ECE-approved LED retrofit lamps with the NIGHT BREAKER LED SPEED ECE H8, HB4 and H16. The new lamps expand the options for retrofitting t... READ MORE

Vehicle interiors are changing fundamentally. Displays are becoming larger, surfaces smarter, and light is evolving from a design element into an intuitive communication surface. With the new ALIYOS™ Bond Vision demonstrator, ams OSRAM i... READ MORE