2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
Continue reading

Macroblock, a leading provider of LED driver ICs, is making its debut at SID Display Week, the world’s premier event for display technologies, held from May 5 to May 7. At the exhibition, Macroblock is showcasing a broad portfolio of pro... READ MORE

Philips Hue and Philips Smart Lighting (connected by WiZ) - part of Signify, the world leader in lighting - have announced the launch of Sports Live, a new software available during the Championship 2026. Sports Live uses live match data to tr... READ MORE