2011-12-01

ASMPT CEO W. K. Lee: SIPLACE integration is making good progress From wafer to SMT placement: SIPLACE parent ASMPT offers a wide range of solutions for the electronics industry

On the occasion of the SIPLACE press conference for the upcoming Productronica trade show in Munich, W. K. Lee, CEO of ASM Pacific Technology (ASMPT), pointed out that the ASM Group is now the supplier with the widest-ranging technology and product portfolio for the electronics industry. ASMPT is the only equipment manufacturer in the world that integrates solutions for all process stages from front-end (wafer design and production) to back-end assembly (chip packaging, bonding, etc.) to SMT placement solutions provided by the SIPLACE team. W. K...
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2011-12-01

SIPLACE Press Conference:SIPLACE team well-positioned for the future of electronics production

Good news from the management of ASM Assembly Systems GmbH & Co. KG (formerly Siemens Electronics Assembly Systems) at the SIPLACE press conference in Shenzhen. SIPLACE COO in China, Herbert Hofmann, presented a whole series off innovative SIPLACE solutions for the following process steps: new product introduction (NPI), setup changeover and production run. Based on the globally leading SIPLACE placement platform, integrated hardware, software and service innovation will help especially electronics manufacturers in China and Asia to...
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Civic engagement combined with an innovative solar lighting concept from LEDVANCE has made the Nelson Mandela Bridge – one of South Africa’s most important landmarks – safe and visible once again. In just three weeks, LEDVANCE, ... READ MORE
Premstaetten, Austria, and Munich, Germany (September 18, 2025) In automotive electronics, reliability is a key design criterion. Capacitive sensors are widely used in exterior and interior vehicle applications—from touch-based door hand... READ MORE