Alpha Assembly Solutions to Present at South East Asia Technical Training Conference on Electronics Assembly in Penang

Alpha Assembly Solutions, a specialist in the production of electronic soldering and bonding materials, will be presenting two technical papers “Flip-Chip LED Assembly – Processes and Challenges” and “LED Assembly on Flexible Substrates” at the South East Asia Technical Training Conference on Electronics Assembly Technologies 2017 which is hosted by SMTA from March 28-30, 2017 at Oliver Tree Hotel in Penang, Malaysia.

(Alpha Assembly Solutions/ LEDinside)

The first paper titled “Flip-Chip LED Assembly – Processes and Challenges” will discuss on the effect of application process, process settings and solder paste on assembly outputs. This study is relevant for LED packaging and LED module assembly makers who use flip chip for automotive, backlight and general lighting applications.

The second paper titled “LED Assembly on Flexible Substrates” will provide insight into the world of LEDs on flexible circuits. The presentation includes end-applications and drivers for LED on flex including material stack selection particularly, details on low to mid temp alloys and interconnects on both polyimide and PET based circuits.

Additionally, the impact / performance of typical material stacks in the form of applications studies will be reviewed and lastly the future of flexible circuitry form factor evolution will be discussed.

For more information on Alpha’s vast product offering and capabilities, please visit AlphaAssembly.com or the detailed agenda of conference at www.smta.org/southeast-asia/

TECHNICAL PAPER PRESENTATION:

Wednesday, 29th March 2017 | 03:00-03:30

Topic: Flip-Chip LED Assembly – Processes and Challenges

Speaker: Gyan Dutt, Technical Marketing Manager of LED – Alpha Assembly Solutions

Wednesday, 29th March 2017 | 04:00-04:30

Topic: LED Assembly on Flexible Substrates

Speaker: Amit Patel, Project Manager of LED – Alpha Assembly Solutions

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