2016-09-26

Holst Center Releases OLED on Ceramic Substrate

Dutch R&D institute Holst Centre (set up by imec and TNO) and American ultra-thin ceramics supplier ENrG Inc. have created the first ever ceramic-based, large-area flexible OLED. The device, manufactured on the 20-40 µm thick Thin E-Strate® ceramic substrate, promises a lifetime in excess of 10 years without the formation of blackspots. The ceramic carrier is also easy to handle and capable of withstanding the high temperatures used in display backplane manufacturing and standard sintering processes.
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2015-01-22

Cree Launches High Power Ceramic COB LED

Building on the success of the groundbreaking XLamp® MH family of LEDs, Cree introduces the XLamp MHD-E and MHD-G LEDs, the high-power LEDs that combine the high lumen density and reliability of a ceramic chip-on-board LED with the design and manufacturing advantages of a surface-mount package. Utilizing elements of the Cree SC5 Technology™ Platform, the ceramic XLamp MHD LEDs simplify development, increase design flexibility and improve manufacturing efficiency compared to mid-power LEDs. The MH family enables new designs and significantly lower system costs, all while delivering industry-leading performance.
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2014-06-03

3M Launches New LED Chip Package Substrate an Alternative to Ceramic

3M Electronics Materials Solutions Division today announced the launch of its new 3M™ LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic substrates. The new substrate, constructed of copper and polyimide, is able to meet the electrical and thermal performance required of high-power LED chips at a competitive price compared to high performance ceramic substrates. 3M offers the substrate in a tray and a reel format. 
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2014-03-03

Flip Chip Propels Tong Hsing Electronics Industry Ceramic Substrate Technology

Large ceramic wafer manufacturer Tong Hsing Electronics Industries’ annual ceramic substrate for LED revenue grew 10 percent. As LED lighting applications mature, the LED industry is optimistic and is rapidly transforming the industry. New designs, materials, and manufacturing processes are being verified. Among these  flip-chip products were continually launched, driving demand for high heat resistance performance. The market anticipates that Tong Hsing will benefit.
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Specifiers can realize the best quality of light and the highest levels of light output and efficacy at 3000K and 95CRI San Jose, CA – Lumileds today announced substantial performance improvements for its 90 and 95 CRI LUXEON CoBs with C... READ MORE

For many years, XLamp® XP-E2 LEDs have been the preferred LED choice for lighting manufacturers looking to combine different colors of light together to service specialty lighting applications. The XP-E2 platform offers an unbeatable combi... READ MORE