2012-06-20

Daewon Innost Makes Breakthroughs on Silicon COB LED Substrate

Daewon Innost has made a breakthrough on its Glaxum LED Array family of chip on board (COB) modules, which it claims to achieve the LED industry’s best thermal dissipation performance. The proprietary Nano-Pore Silicon Substrate (NPSS) technology developed by Daewon Innost led to thermal impedance of 0.41°C/W. Daewon Innost’s NPSS is created by applying semiconductor lithography to silicon wafers, allowing for 50µm-pitch interconnection between gallium nitride (GaN) LED chips; conventional metal-core printed circuit boards (MC...
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Tokushima, Japan - 6 March 2024: Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, has started mass production of the new UV-B (308nm) and UV-A (330nm) LEDs in its popular 434 Series packa... READ MORE

New XLamp® S Line LEDs enhance growth, last longer, lower energy costs Horticulture and other forms of agricultural lighting require application-tuned ratios of spectral content, high efficacy and long lifetimes. Whether you are interested... READ MORE