2015-05-12

Alpha to Present Paper on LED Die Attach Technologies at GILE 2015

Alpha, the world leader in the production of electronic soldering and bonding materials, will present a technical paper on LED die attach technologies at the upcoming Guangzhou International Lighting Exhibition (GILE) taking place June 9th – 12th in China.
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The TMF8829 direct Time-of-Flight (dToF) sensor significantly increases resolution — from the previously common 8×8 zones to 48×32 — and it is designed to detect subtle spatial differences and distinguish closely spaced... READ MORE

Introducing the New J Series® 3030S 3V & 6V LEDs Cree LED is expanding the proven J Series 3030 portfolio with four new high-performance LEDs that combine a 757-footprint with outstanding efficacy and drop-in compatibility with popula... READ MORE