2019-02-01

Foldable PeLED and 3D Image Sensing Core Chip Developed by Korean Research Teams

Researchers at the Ulsan National Institute of Science and Technology (UNIST) and the Korea Advanced Institute of Science and Technology (KAIST) have achieved new technology developments including foldable flexible perovskite LEDs and a core chip for 3D image sensors respectively, reported BusinessKorea. The research team at UNIST announced that it has developed foldable perovskite LEDs (PeLED) with a transparent material as electrode of the device. PeLED uses perovskite material as light emitting layer through electricity. In the study, resear...
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International automotive supplier FORVIA HELLA has fully localized its digital, high-resolution headlamp system SSL | HD in China for the first time in the context of a new series project. Both series development as well as manufacturing take ... READ MORE

Heart rate, blood flow, and other physiological metrics have been central to health monitoring for decades. However, numerous relevant changes in the human body develop insidiously over time and may go undetected when relying on single measure... READ MORE