On July 3, BOE disclosed its latest investor relations update, outlining recent progress in optical interconnects, glass core substrates, perovskites, as well as its LCD and OLED businesses.

Optical interconnect is one of BOE’s key strategic focus sector. The company said it plans to give full play to its long-standing expertise in display technologies, glass processing, and large-scale intelligent manufacturing to advance optical interconnect and glass-substrate co-packaged optics (CPO) technologies.

To accelerate development, BOE has established dedicated project teams for Micro LED optical interconnect systems and glass-substrate CPO technologies, working alongside ecosystem partners on early-stage technology research and the development of key enabling technologies.

Meanwhile, BOE HC SemiTek revealed that its Micro LED chips for communication application have already been delivered to overseas customers, with product specifications continuing to undergo validation and optimization. Going forward, the company plans to expand into high-speed Micro LED epitaxy, chips, and light-emitting modules tailored for communication systems, while collaborating with strategic partners across the supply chain to achieve technological breakthroughs.

Regarding glass-based packaging substrates, BOE noted that commercialization will depend on close collaboration across the industry ecosystem, including equipment suppliers, material vendors, and customers. The company will continue refining manufacturing processes, improving yields, and accelerating product commercialization in response to customer demand.

BOE also provided an update on its partnership with Corning. By combining their respective strengths in display technologies, optical materials, and connectivity solutions, the two companies are jointly advancing projects involving glass core substrates, optical interconnects, perovskites, and foldable glass. According to BOE, the partnership has entered the execution phase, with multiple projects already underway and progress to be reviewed on a quarterly basis.

Looking ahead, BOE will prioritize the development of emerging business, including glass core substrates, perovskites, and Micro LED optical interconnects. The company said its perovskite business will capitalize on its micron-scale processing capabilities to drive commercialization, while its glass core substrate business will extend manufacturing capabilities into the nanometer scale. For Micro LED optical interconnects, BOE aims to leverage its expertise in display technologies, glass processing, and intelligent manufacturing to advance key technologies and accelerate product development.

(Photo credit: BOE)

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