Hongshi Intelligent is a tech company deeply involved in the research and manufacturing of silicon-based Micro LED microdisplay chips. The company possesses core technologies and patents including 8-inch silicon metal bonding, quantum dot conversion, hybrid bonding, monolithic full-color, and microlenses. Hongshi Intelligent has a complete industry chain capability, from optical device design to module design and production. The products of Hongshi Intelligent can be applied to monochrome/full-color AR glasses, smart wearable devices, micro-projectors, and other consumer electronics. They also show great potential in digital lighting and the automotive sector. The single green Micro LED optical engine (used for AR glasses) achieved mass production and shipment in 4Q24. TrendForce has invited Liu Yi, Vice General Manager for New Market Expansion at Hongshi Intelligent, to share the latest Micro LED products and technological advancements from the company.

Liu Yi, Vice General Manager for New Market Expansion of Hongshi Intelligent

Hongshi Intelligent identifies three key points in its technology and product strategy: (1) Choosing the 8-inch silicon-based GaN route to break cost restrictions, (2) using the Aurora A6 single green series to support mass production, adapt to market pace, and establish a strong foothold, as well as (3) developing solutions for tricolor light combining and single-panel hybrid stacked full-color products, advancing along multiple routes to seek development opportunities.

One-Step 8-inch Silicon-Based GaN Process Improves Utilization Rate of CMOS Bonding
Compared to the traditional 4-inch or 6-inch sapphire-based GaN epitaxy technology, Hongshi Intelligent went with the 8-inch silicon-based GaN technology route upon entering the Micro LED field. While this choice involved significant short-term investment in production line construction and process debugging, the 8-inch silicon-based GaN solution offers higher area utilization when bonding with CMOS in the medium to long term, thereby achieving effective cost reduction. Hongshi Intelligent also stated that when matched with future mainstream 12-inch CMOS substrates, the 8-inch silicon-based GaN technology will face fewer bottlenecks pertaining to processes and technical switching compared to sapphire as sizes continue to scale up. Based on this foundation, Hongshi Intelligent has also launched a variety of products.

Single-Color Products Now Mass Produced; Full-Color Solutions Expediting in Progress
Hongshi Intelligent believes that the Micro LED AR market is still in an exploratory phase, with single green products, used in scenarios such as indoor meetings or outdoor cycling, being the main shipment drivers. The Aurora A6 is a Micro LED microdisplay product launched by Hongshi Intelligent with an ultra-high energy efficiency ratio, and is able to generate an output of 3 million nits/100 mW at a stable manner, with a chip size of 0.12-inch and a pixel pitch of 3.75 micrometers.

Aurora A6 Microdisplay Chip

Full-color remains a key challenge for Micro LED AR products. Hongshi Intelligent stated that full-color solutions are also accelerating toward implementation, starting with tricolor light combining, which has relatively mature processes and more controllable yield rates, as a feasible solution for the short to medium term. Based on its superior single red microdisplay product with quantum dot color conversion (Hongshi Intelligent is the first Micro LED microdisplay company to surpass 2 million nits in single red product brightness), Hongshi Intelligent will launch the Aurora XC6 (X-cube) light engine in 2025. This product has a volume of 0.35cc and a combined light brightness of over 2.5 million nits. While achieving ultra-high brightness, its luminous efficacy reaches 8 lm/W, effectively balancing brightness and power consumption.  

Aurora XC6

All the while, Hongshi Intelligent is continuously developing a third-generation hybrid bonding technology platform to support the development of monolithic full-color products. The currently launched monolithic full-color AC3 microdisplay chip utilizes Hongshi Intelligent’s unique hybrid stacked structure on this third-generation technology platform. This technology integrates two wafer bonding processes and a single quantum dot color conversion process, achieving the integration of blue and green epi wafers and the precise rendering of red light, with white light brightness reaching up to 1.2 million nits.

Monolithic Full-Color Microdisplay Chip AC3

Hongshi Intelligent stated that 2026 will see the expansion of mass production of single green products and the accelerated iteration of color product solutions. Monochrome products will reduce the pixel pitch to 2.5 micrometers, thereby improving product resolution, brightness ceiling, and module size. For full-color products, early 2026 will see the launch of a 0.18 cc X-cube solution with a pixel pitch of 2.5 micrometers and a 2 million nits monolithic full-color microdisplay chip.

Micro LED Currently Focused on Microdisplay for Development; May Expand to Non-Display Fields in the Long Term
Hongshi Intelligent stated that Micro LED technology is one of the important technological paths for achieving lightweight AR glasses, and is key to complementing diffraction waveguide technology with higher potential. The collective efforts of the industry is expected to accelerate the development of the AR glasses industry. Additionally, product size and application scope will gradually expand as product performance and technology maturity improve. The long-term plan will also consider extending into non-display applications of Micro LED technology, such as optical communication and optical connection fields.

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